Development of semiconductor promote terminals
2017-11-08
With the semiconductor chip with the blind with the extensive application of the technology, the direct promotion of the new development of the terminal block. This requires the development of terminals manufacturers continue to research new technologies, in order to increase their core competitiveness, and to adapt to the application needs of the market.
Electronic products is more and more powerful and comprehensive, the connector higher, more diverse needs, such as increasing the transmission rate of the electronic equipment, to meet the large flow of data transmission and exchange on Connectors made ??of high-speed transmission and digital transmission requirements. However, for the device space savings, reduced equipment volume, will need to integrate more and more of the signal, such as a microwave signal, the optical signal, the high-voltage signal, the power signal to the same connector, and require independent transport between the respective signals, and mutual do not interfere, which determines the the connector signal transmission integrated development trend will be more and more obvious.
The market for connectors concentration and the need for miniaturization trend, prompting terminals technological innovation. Semiconductor chip technology is becoming the driving force of the development of the technical levels of interconnect connector, for example, accompanied by a 0.5mm pitch chip package quickly to 0.25mm pitch development, so I level interconnect (IC devices internal) and class II interconnect (device interconnected with the board), the number of device pins by hundreds of lines up to thousands of lines. Press-fit contacts techniques commonly used in the a cylindrical slotted jack, flexible stranded pin hyperboloid wire spring jack connector, greatly improving the reliability of the connector to ensure signal transmission fidelity.
Terminals technology enables blind mating connector to constitute a new connector products, namely push-in connectors, it is mainly used for system-level interconnect, its biggest advantage is no cable, simple installation and removal, easy field replacement and interpolation together fast, smooth and stable separation, get a good high-frequency characteristics, suitable for spacecraft. Connector assembly technology is being used by the plug-in installation technology to the development of surface mount technology, the future trend is to the development of micro-assembly technology, the use of micro-electromechanical systems will improve the technology and cost-effective power connector.
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